Digital Engineering June 2023

The June issue of Digital Engineering focuses on the automotive industry, including virtual manufacturing, synthetic data for automotive simulation, and hybrid manufacturing, as well new engineering workstations and a report from RAPID+TCT 2023.

Inside This Issue:

Automotive Manufacturing Gone Virtual

AR, VR, digital twins and 3D prototyping all play roles in the future of the automotive market.

Seeking Misbehaving Virtual Drivers

Simulating accidents in mixed reality is a critical step for the future of autonomous vehicles.

When Real-World Data is Not Enough

Spawning synthetic data from real-world data is an important aspect of autonomous vehicle training.

Galvanizing Hybrid Manufacturing Workflows

As all-in-one solutions emerge, software and automation are streamlining additive manufacturing and other manufacturing processes into optimized and integrated production workflows.

Is AI Ready to Make Autonomous Vehicles a Reality?

Automotive OEMs are bringing the power of artificial intelligence to the development of self-driving cars.

Case Study: AI Solves Fuel Tank Engineering Challenge

Kautex-Textron turns to AI and machine learning to reduce noise in its fuel tanks.

Technology Reshapes Workstation Market

New processors are unlocking unprecedented levels of power for engineers.

Download today

Latest News

Supermicro Delivers Direct-Liquid-Optimized NVIDIA Blackwell Solutions
The new SuperCluster will increase the number of NVIDIA HGX B200 8-GPU systems in a liquid-cooled rack, according to Supermicro.

ADDMAN Group and Continuous Composites Partner
As the commercial transition partner, ADDMAN will produce test parts and prototypes, propelling CF3D into applications like hypersonics and...

Meet the Latest Star Wars Droid Designers
Droid design contest winners discuss process, inspiration.

Materialise Announces Collaborations and Software Updates
The updates allow users to create custom workflows in Magics software, protect the intellectual property behind component designs, and print...

HP Debuts Innovations and Collaborations
HP introduces new software tools and products with Autodesk, Materialise, and Fabrex to enhance workflow optimization and reduce production costs,...

Ansys Government Initiatives Picked to Join Microelectronics Commons
Ansys Government Initiatives—the U.S. national security division of Ansys—will work with industry, academic, and government organizations to...

All posts