Ansys 2025 R1 Update Expands Cloud and AI Functionality

Ansys 2025 R1 features refined digital engineering-enabling technologies that integrate with existing infrastructure. Enhanced by AI, cloud computing, GPUs, and HPC, Ansys R1 enhancements enable faster, collaborative decision-making, broader design exploration, and reduced product design timelines. 

“Ansys 2025 R1 offers more integration capabilities than ever, helping teams carve a digital path through the entire lifecycle of a product, with tools and solutions to help expertly manage data pre- and post-development,” says Shane Emswiler, senior vice president of products at Ansys. “This release highlights that our solutions can serve as guideposts, helping disconnected teams stay the course and work collaboratively from a single, accessible source of truth.”

Advanced Physics Solvers

The latest release from Ansys highlights new products and capabilities:  

• Ansys Discovery 3D simulation software expands thermal modeling with the addition of electrothermal analysis, orthotropic conductivity, and internal fans.
• The structural analysis suite features a fully integrated solution for noise, vibration, harshness (NVH).
• Ansys Electronics connects to other Ansys software products, enabling improved meshing.
• A new Polymer FEM product utilizes high-fidelity models to capture real-world materials behavior.

Cloud, HPC, and GPUs

Ansys R1 highlights advancements to its GPU solvers and adds web-based, on-demand capabilities to a variety of applications:

• The Ansys Fluent multi-GPU fluid simulation solver supports applications with high total mesh cell counts, such as automotive external aerodynamics. 
• Ansys CFD HPC Ultimate enables enterprise-level CFD capabilities for one job on multiple CPU cores or GPUs without needing additional HPC licenses.
• New GPU-accelerated simulations in Ansys Lumerical FDTD advanced 3D electromagnetic simulation software uses less GPU memory and provides reduction in meshing time compared to CPUs. 
• Ansys Cloud Burst Compute with Discovery empowers designers to solve 1,000 design variations in minutes. 
• The Ansys Cloud Burst Compute capability provides on-demand HPC capacity for Ansys Mechanical, Fluent, and Ansys HFSS high-frequency electromagnetic simulation software.

Artificial Intelligence

Ansys AI allows teams to use new or previously generated data to analyze designs, train their own AI models and more:

• Ansys has developed an intuitive, interactive tool to streamline data preparation for SimAI modeling.
• SimAI allows users to expand the training data to gain insight during post-processing.
• Ansys Electronics AI+ uses AI-driven techniques to predict resources and runtime for electronics simulations in Ansys Maxwell advanced electromagnetic field solver, Ansys Icepak® electronics cooling simulation software, and HFSS

Connected Ecosystem

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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