DE · Topics · Resources · Materials · Sponsored Content

Simulation of Ultrasonic Non-Destructive Testing of Composite Materials

This white paper provides an overview of how different NDT techniques can be modeled and simulated, highlighting the need for modern CAE tools that enable an efficient exploration of all variables involved.

This white paper discusses how ultrasonic non-destructive testing (NDT) can be efficiently and effectively optimized, thus reducing costs and risks, with the use of accurate engineering simulations.

With OnScale software, research and design engineers can run multiphysics simulations of many ultrasonic inspection techniques that include piezoelectricity, electrical circuits, structural mechanics, acoustics, and heat transfer phenomena.

OnScale is fully cloud-enabled, empowering engineers with the high-performance computing (HPC) resources needed to explore their design space quickly and with ease. Semiconductors, MEMS, sensors, medical devices, and 5G and IoT RF systems are among the many applications that can benefit from design and optimization with OnScale.

Testing Simulation for Composite Materials

A key consideration for materials used in the aerospace industry is to ensure the strength of aircraft components, while limiting weight. For this reason, aerospace design challenges have driven major advances in composite materials, which offer both increased mechanical strength and weight savings.

This is epitomized by modern aircraft such as the Boeing 787, which contains 50% composite material by weight. In addition to their favorable strength-to-weight ratio, composites are also quickly becoming the material of choice in aerospace applications due to their durability, resistance to corrosion and fatigue, and the potential they offer for new design solutions.

Fill out the information below to download the resource.

By downloading this content, I agree to receive the DE 24/7 Newswire, a twice weekly free email newsletter (you may choose to opt-out in the newsletter).

Latest News

Nexa3D Signals Winding Down Operations
AM hardware maker Nexa3D issues alert to customers signaling scaling back

Technology Outlook 2025
DE readers let us know how they are adopting new engineering technology in our annual survey.

Ansys Collaborates with Sony Semiconductor Solutions
Collaboration empowers OEMs and Tier 1 suppliers to evaluate and verify performance of ADAS/AV functionality in all weather and lighting...

Indy Autonomous Challenge Returns to CES 2025
Event set to take place on January 9, 2025 at the Las Vegas Motor Speedway from 2-4 PM PST.

3E EOS Expands AM Capabilities With Help From Stratasys
New investment includes F3300 printers, enhancing capabilities from prototyping to tooling and production for the aerospace, defense and automotive sectors,...

UCF Joins Digital Twin Consortium as Regional Organizer
University of Central Florida Research Foundation joins DTC as Regional Branch Organizer for Southeast USA

All posts