The “Cool” Factor - Optimization of Thermal Performance
As IoT and other devices are being squeezed into tiny form factors, electronic designs are getting ever more complicated. Join us in this webinar as we discuss ways to optimize thermal performance by tweaking the following: air flow, component placement, heat sink performance and fan placement. Come see how you can optimize the thermal performance of your electronic designs, helping you get to market faster with better product.
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April 3, 2018
As IoT and other devices are being squeezed into tiny form factors, electronic designs are getting ever more complicated.
Join us in this LIVE webinar May 15 at 2 p.m. as we discuss ways to optimize thermal performance by tweaking the following:
- Air flow
- Component Placement
- Heat Sink Performance
- Fan Placement
Come see how you can optimize the thermal performance of your electronic designs. Helping you get to market faster with better product.
Download or learn more today
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Latest News
Ansys Government Initiatives Picked to Join Microelectronics Commons
Simplify Simulation Data Analysis with Noesis Solutions Tool
Lantek Launches v44 of its Sheet Metal Manufacturing Software
Nano Dimension Unveils 3D Printer for Micro Applications
Prusa CORE One 3D Printer Serves as Foundation of New Line
Dassault Systèmes Announces Winners of India-Based Product Design Competition
All posts
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