Siemens Expands Partnership with AWS
The goal is to focus on helping mutual integrated circuit (IC) and electronics design customers leverage AWS’s advanced cloud services to shorten design cycles, the companies report.
![](https://www.digitalengineering247.com/images/article/Siemens-EDA-AWS-newsroom-1280x720-1-600.jpg)
Siemens and AWS are collaborating to develop Cloud Flight Plans, which are best-known methods (BKMs) and technologies for running Siemens’ EDA tools in customers’ AWS environments. Image courtesy of Siemens.
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July 18, 2023
Siemens Digital Industries Software is expanding its strategic collaboration agreement (SCA) with Amazon Web Services (AWS). The goal is to focus on helping mutual integrated circuit (IC) and electronics design customers leverage AWS’s advanced cloud services to shorten design cycles, optimize engineering resources and boost verification coverage using current and forthcoming Siemens EDA products. This extended SCA builds upon the companies’ track record of providing customers with the agility, flexibility and adaptability needed.
High-performance cloud computing provides IC and systems developers with ways to address design complexity, demand for computing capacity, and distributed, cross-organization collaboration.
Siemens and AWS are collaborating to develop Cloud Flight Plans, which are best-known methods (BKMs) and technologies for running Siemens’ EDA tools in customers’ AWS environments. Cloud Flight Plans target customers looking to self-manage their AWS environments.
“IC development is a compute-intensive process, so having ready access to additional capacity and alternative system configurations is extremely valuable to our customers,” says Craig Johnson, vice president, EDA Cloud Solutions for Siemens Digital Industries Software. “Deployment complexity has historically been a major challenge. Our expanded collaboration with AWS focuses on combining our mastery of electronics design with AWS’s infrastructure, consulting and cloud deployment assistance to accelerate our mutual customers’ outcomes.”
“AWS is accelerating the performance of IC and electronics design workloads by delivering elastic, high-performance computing (HPC) for the most sophisticated EDA solutions,” says Bill Vass, vice president of engineering, AWS. “Our strategic collaboration with Siemens allows mutual customers to create innovate new products in the cloud today, and now includes significant semiconductor innovation with Siemens EDA.”
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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