Siemens Debuts Innovator3D IC

Siemens unveils Innovator3D IC, new software that delivers a fast, predictable path for the planning and heterogeneous integration of application-specific integrated circuits (ASICs) and chiplets using advanced semiconductor packaging 2.5D and 3D technologies and substrates.

Click here to watch the Innovator3D IC keynote presentation video.

Innovator3D IC provides a consolidated cockpit for constructing a digital twin—featuring a unified data model for design planning, prototyping and predictive analysis—of the complete semiconductor package assembly. This cockpit drives implementation, multiphysics analysis, mechanical design, test, signoff and release to manufacturing.

By unifying power, signal, thermal, and mechanical stress analysis tools, it enables rapid what-if exploration, while identifying, avoiding and solving challenges prior to detailed design implementation. This shift-left approach can prevent downstream rework or suboptimal results.

“Siemens already had a portfolio of semiconductor packaging related technologies available as part of Siemens Xcelerator, by combining these with Innovator3D IC we enable customers to achieve the realization of more-than-Moore,” says AJ Incorvaia, senior vice president of Electronic Board Systems at Siemens Digital Industries Software.

Unified Cockpit

Innovator3D ICs unified cockpit is for design planning, prototyping and predictive multiphysics analysis. This cockpit constructs a power, performance, and area (PPA) and cost optimized digital twin of the complete semiconductor package assembly that in turn drives implementation, multi-physics analysis, mechanical design, test, signoff, and release to fabrication and manufacturing through a managed and secure design IP digital thread conduit

Open Architecture 

Innovator3D IC is architected around the system technology co-optimization (STCO) methodology process developed by IMEC. STCO is utilized throughout prototyping and planning, design, sign-off, and manufacturing hand-off, concluding with verification and reliability assessment. Although the Innovator3D IC cockpit is directly integrated with the Siemens Xcelerator technology portfolio, it supports the integration of third-party point solutions, recognizing that customers may have incumbent third-party tools in their current design flows that they wish to continue using.

Model of Entire Assembly

Innovator3D IC constructs and maintains a 3D digital twin of the entire device including chiplets, interposers, substrates, and even the system printed circuit board. Through its hierarchical device planning capability, chiplet and ASIC floorplans and their external interface assignments can be defined and optimized for overall cost targets. 

Industry Standards Support

A key tenant of Innovator3D IC is support of industry standard formats, protocols, and application programming interfaces. A key area is support for the 3Dblox standard that enables electronics design automation tool interoperability in 3D integrated circuit system level designs. Next is to ensure frictionless adoption and consumption of existing and new die-to-die inter]face IP. The Open Compute Projects Chiplet Design Exchange Working Group (OCP CDX) has enabled direct consumption of standardized chiplet models that will be provided by the commercial chiplet ecosystem.

For more product details, click here.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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