Intel Certifies Ansys Multiphysics Solutions for Signoff Verification
Ansys electromagnetic analysis tools optimize semiconductor products for high-performance computing, 5G and AI applications.
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Ansys PathFinder-SC uses the same elastic compute infrastructure to verify the electrostatic discharge (ESD) protection circuitry found on all chips. Image courtesy of Ansys.
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July 25, 2023
Intel Foundry Services (IFS) certified Ansys multiphysics solutions for signoff verification of advanced integrated circuits (ICs) designed with the Intel 16 silicon manufacturing process. The collaboration with IFS validated a electronic design automation (EDA) flow that delivers productivity for joint customers, the companies report.
Ansys RedHawk-SC and Ansys Totem are solutions of cloud-enabled data infrastructure that provide capacity to analyze full-chip designs, hierarchically or flat. Ansys PathFinder-SC uses the same elastic compute infrastructure to verify the electrostatic discharge (ESD) protection circuitry found on all chips.
“Ansys and IFS, with a history of close collaboration, are pleased with the broad support of our Intel 16 process including our RF capabilities,” says Rahul Goyal, vice president and general manager for Intel's Product & Design Ecosystem Enablement group. “We believe in providing our foundry customers with the widest possible array of industry-leading EDA tools that work in their existing design platforms and that make optimal use of our advanced manufacturing technology.”
“Ansys works with leading foundry partners like Intel Foundry Services to address complex multiphysics challenges and meet stringent power, performance, and reliability requirements,” says John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. “Ansys' signoff platform helps empower mutual customers to accelerate design convergence with greater confidence thanks to the collaborative work between the companies to ensure silicon predictive accuracy and a smooth user experience.”
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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