DE Editors’ Chat: Rapid + TCT Conference, Ansys Indy Autonomous Challenge, 3D-Printed Bridge, More
DE Editors discuss Conference Travel, Virtual Race, Simulation in Olympics, and More
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DE Editors’ Chat: Rapid + TCT Conference, Ansys Indy Autonomous Challenge, 3D-Printed Bridge, More Duration
18:20 hrs/min/sec
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August 9, 2021
The Additive Manufacturing User Conference (AMUG, May 2-6, Orlando) and Rapid + TCT (September 13-15, Chicago) kicked off the onsite engineering conference season after a long shutdown. On the other hand, SIGGRAPH 2021 and Autodesk University (AU) 2021 remain virtual.
Also in the news are HP's acquisition of the remote connection technology provider Teradaci, the delivery of a 3D-printed bridge in Amsterdam made with MX3D's technology, a virtual race hosted by the simulation software maker Ansys, and the use of simulation in the Tokyo Olympics.
DE Editors Brian and Kenneth discuss the readjustment to conference travel, why some shows thrive and others struggle in the era of Zoom, the rise of large-scale 3D printing, the ongoing debate on the infusion of technology in sporting events, and more.
Listen to the debut episode of DE Editors' Chat above.
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About the Author
Kenneth Wong is Digital Engineering’s resident blogger and senior editor. Email him at kennethwong@digitaleng.news or share your thoughts on this article at digitaleng.news/facebook.
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